Invention Grant
- Patent Title: Semiconductor structure with airgap
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Application No.: US16240304Application Date: 2019-01-04
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Publication No.: US10692753B2Publication Date: 2020-06-23
- Inventor: Mark D. Jaffe , Alvin J. Joseph , Qizhi Liu , Anthony K. Stamper
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Roberts Calderson Safran & Cole, P.C.
- Agent Steven Meyers; Andrew M. Calderon
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/762 ; H01L29/06 ; H01L29/78 ; H01L29/66 ; H01L21/265 ; H01L21/764 ; H01L21/306 ; H01L29/786 ; H01L27/12 ; H01L21/027 ; H01L21/266

Abstract:
A field effect transistor (FET) with an underlying airgap and methods of manufacture are disclosed. The method includes forming an amorphous layer at a predetermined depth of a substrate. The method further includes forming an airgap in the substrate under the amorphous layer. The method further includes forming a completely isolated transistor in an active region of the substrate, above the amorphous layer and the airgap.
Public/Granted literature
- US20190139819A1 SEMICONDUCTOR STRUCTURE WITH AIRGAP Public/Granted day:2019-05-09
Information query
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