Invention Grant
- Patent Title: Method for attaching light transmissive member to light emitting element for manufacturing light emitting device
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Application No.: US16037763Application Date: 2018-07-17
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Publication No.: US10693045B2Publication Date: 2020-06-23
- Inventor: Rie Maeda
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4fab581e
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/54 ; H01L33/62 ; H01L33/00 ; H01L33/60 ; H01L25/075

Abstract:
The method of manufacturing a light emitting device includes: providing a light-transmissive member having a plate-like shape; providing light emitting elements each having a primary light emission surface and an electrode formation surface; bonding the light emitting elements to a base member such that the electrode formation surfaces of the light emitting elements face an upper surface of the base member; disposing the light emitting elements on the light-transmissive member such that the primary light emission surfaces of the light emitting elements face an upper surface of the light-transmissive member via a light-transmissive bonding member; disposing a part of the bonding member on a lateral surface of each of the light emitting elements; removing a part of the light-transmissive member to form a groove between the light emitting elements; forming a light-reflective member at least in the groove; and cutting the light-reflective member and the base member.
Public/Granted literature
- US20190035986A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2019-01-31
Information query
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