Invention Grant
- Patent Title: Substrate integrated waveguide
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Application No.: US16061540Application Date: 2015-12-14
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Publication No.: US10705293B2Publication Date: 2020-07-07
- Inventor: Robert Alan May , Kristof Darmawikarta , Rahul Jain , Sri Ranga Sai Boyapati , Maroun Moussallem , Rahul N. Manepalli , Srinivas Pietambaram
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2015/065511 WO 20151214
- International Announcement: WO2017/105388 WO 20170622
- Main IPC: G02B6/122
- IPC: G02B6/122 ; G02B6/132 ; H01P5/107 ; G02B6/134 ; G02B6/12

Abstract:
This document discusses, among other things, a waveguide including a first metal having an outer surface proximate a dielectric material and an inner surface defining a path of the waveguide, a method of receiving an optical signal at the inner surface of the waveguide and transmitting the optical signal along at least a portion of the path of the waveguide. A method of integrating a waveguide in a substrate includes depositing sacrificial metal on a first surface of a carrier substrate to form a core of the waveguide, depositing a first metal over the sacrificial metal and at least a portion of the first surface of the carrier substrate, forming an outer surface of the waveguide and a conductor separate from the sacrificial metal, and depositing dielectric material over the first surface of the carrier substrate about the conductor.
Public/Granted literature
- US20190250326A1 SUBSTRATE INTEGRATED WAVEGUIDE Public/Granted day:2019-08-15
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