- 专利标题: CMP stop layer and sacrifice layer for high yield small size MRAM devices
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申请号: US15891767申请日: 2018-02-08
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公开(公告)号: US10714679B2公开(公告)日: 2020-07-14
- 发明人: Yi Yang , Zhongjian Teng , Yu-Jen Wang
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Haynes and Boone, LLP
- 主分类号: H01L43/12
- IPC分类号: H01L43/12 ; H01L27/22 ; C09G1/02 ; H01L43/08 ; H01L43/02 ; G11C11/16
摘要:
An array, such as an MRAM (Magnetic Random Access Memory) array formed of a multiplicity of layered thin film devices, such as MTJ (Magnetic Tunnel Junction) devices, can be simultaneously formed in a multiplicity of horizontal widths in the 60 nm range while all having top electrodes with substantially equal thicknesses and coplanar upper surfaces. This allows such a multiplicity of devices to be electrically connected by a common conductor without the possibility of electrical opens and with a resulting high yield.
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