- Patent Title: Semiconductor package with rigid under bump metallurgy (UBM) stack
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Application No.: US15881063Application Date: 2018-01-26
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Publication No.: US10756040B2Publication Date: 2020-08-25
- Inventor: Ta-Jen Yu , Chi-Yuan Chen , Wen-Sung Hsu
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L23/485
- IPC: H01L23/485 ; H01L23/488 ; H01L23/525 ; H01L29/40 ; H01L23/48 ; H01L23/498 ; H01L23/02 ; H01L23/04 ; H01L23/12 ; H01L23/00 ; H01L23/31
Abstract:
The invention provides a semiconductor package. The semiconductor package includes a semiconductor die and a conductive pillar bump structure and a conductive plug. The semiconductor die has a die pad thereon. The conductive pillar bump structure is positioned overlying the die pad. The conductive pillar bump structure includes an under bump metallurgy (UBM) stack having a first diameter and a conductive plug on the UBM stack. The conductive plug has a second diameter that is different than the first diameter.
Public/Granted literature
- US20180233474A1 SEMICONDUCTOR PACKAGE WITH RIGID UNDER BUMP METALLURGY (UBM) STACK Public/Granted day:2018-08-16
Information query
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