- 专利标题： Semiconductor package with rigid under bump metallurgy (UBM) stack
-
申请号： US15881063申请日： 2018-01-26
-
公开(公告)号： US10756040B2公开(公告)日： 2020-08-25
- 发明人: Ta-Jen Yu , Chi-Yuan Chen , Wen-Sung Hsu
- 申请人： MEDIATEK INC.
- 申请人地址： TW Hsin-Chu
- 专利权人： MediaTek Inc.
- 当前专利权人： MediaTek Inc.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Wolf, Greenfield & Sacks, P.C.
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H01L23/488 ; H01L23/525 ; H01L29/40 ; H01L23/48 ; H01L23/498 ; H01L23/02 ; H01L23/04 ; H01L23/12 ; H01L23/00 ; H01L23/31
摘要：
The invention provides a semiconductor package. The semiconductor package includes a semiconductor die and a conductive pillar bump structure and a conductive plug. The semiconductor die has a die pad thereon. The conductive pillar bump structure is positioned overlying the die pad. The conductive pillar bump structure includes an under bump metallurgy (UBM) stack having a first diameter and a conductive plug on the UBM stack. The conductive plug has a second diameter that is different than the first diameter.
公开/授权文献
信息查询
IPC分类:
