Invention Grant
- Patent Title: Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
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Application No.: US16020271Application Date: 2018-06-27
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Publication No.: US10756161B2Publication Date: 2020-08-25
- Inventor: Shivasubramanian Balasubramanian , Dilan Seneviratne
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L23/498 ; H01L23/522 ; H01L27/08
Abstract:
A semiconductor package substrate includes an integral magnetic-helical inductor that is assembled during assembly of the semiconductor package substrate. The integral magnetic-helical inductor is located within a die footprint within the semiconductor package substrate.
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