Invention Grant
- Patent Title: Pattern forming method, method for manufacturing electronic device, and laminate
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Application No.: US15904439Application Date: 2018-02-26
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Publication No.: US10761426B2Publication Date: 2020-09-01
- Inventor: Hideaki Tsubaki , Wataru Nihashi , Toru Tsuchihashi , Kei Yamamoto
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2f2f5425
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G03F7/11 ; G03F7/039 ; G03F7/09 ; G03F7/32 ; G03F7/075 ; H01L21/027 ; G03F7/095

Abstract:
The pattern forming method includes forming an actinic ray-sensitive or radiation-sensitive film using an actinic ray-sensitive or radiation-sensitive composition, forming an upper layer film using a composition for forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film, exposing the actinic ray-sensitive or radiation-sensitive film having the upper layer film formed thereon, and developing the exposed actinic ray-sensitive or radiation-sensitive film using a developer containing an organic solvent, in which the composition for forming an upper layer film includes a resin and at least one of a compound capable of generating an acid with actinic rays or radiation, a compound capable of generating an acid with heat, and an acid, in which the resin includes a repeating unit represented by General Formula (II). The method for manufacturing an electronic device includes the pattern forming method. A laminate includes the film and the upper layer film.
Public/Granted literature
- US20180180996A1 PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND LAMINATE Public/Granted day:2018-06-28
Information query
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