The invention relates to a semiconductor component comprising: a semiconductor chip (10) which has a semiconductor body (1) with an active region (12) and a substrate (3) with a first conductor body (31), a second conductor body (32) and a first moulded body (33); and a second moulded body (5); wherein the second moulded body (5) completely surrounds the semiconductor chip (10) in lateral directions (L), the semiconductor chip (10) extends all the way through the second moulded body (5) in a vertical direction (V), at least some parts of an upper side and a lower side of the semiconductor chip (10) are not covered by the second moulded body (5), the substrate (3) is mechanically connected to the semiconductor body (2), the active region (12) is connected to the first conductor body (31) and the second conductor body (32) in an electroconductive manner, and the second moulded body (5) is directly adjacent to the substrate (3) and the semiconductor body (1).