Invention Grant
- Patent Title: Enhanced adhesive materials and processes for 3D applications
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Application No.: US16004028Application Date: 2018-06-08
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Publication No.: US10767084B2Publication Date: 2020-09-08
- Inventor: James L. Hedrick , Robert Dennis Miller , Deborah Ann Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION , James L. Hedrick , Robert Dennis Miller , Deborah Ann Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt, Wallace & Kammer, LLP
- Agent Daniel Morris
- Main IPC: C09J9/00
- IPC: C09J9/00 ; B32B17/00 ; C09J179/08 ; C09J11/04 ; H01L23/16 ; B32B33/00 ; C09J11/06 ; C09J179/04 ; C09J183/04 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L21/768 ; H01L21/683 ; H01L23/60 ; H01L23/48 ; B82Y30/00 ; B82Y40/00 ; C08K5/544 ; C08K5/548 ; C08K5/5425 ; C08K5/5465 ; C08K7/24 ; C08K3/04
Abstract:
The present invention related to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.
Public/Granted literature
- US20180340100A1 ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS Public/Granted day:2018-11-29
Information query
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