Invention Grant
- Patent Title: Wiring harness assembly having multiple separated conductors embedded within a substrate
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Application No.: US16203691Application Date: 2018-11-29
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Publication No.: US10777334B2Publication Date: 2020-09-15
- Inventor: Jared Bilas , David R. Peterson , Kurt P. Seifert , Christopher G. Reider , Doyeon Y. Sohn , Gerald A. Rhinehart, Jr. , Therese G. Stevens , George A. Drew , John T. Kightlinger
- Applicant: Aptiv Technologies Limited
- Applicant Address: BB St. Michael
- Assignee: Aptiv Technologies Limited
- Current Assignee: Aptiv Technologies Limited
- Current Assignee Address: BB St. Michael
- Agency: Billion & Armitage
- Agent Robert Myers
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01B7/02 ; H01B13/00 ; H01B13/012 ; H01B7/36 ; H01B7/40 ; H01R27/02 ; H01R13/502 ; H01R12/67 ; B60R16/02 ; B33Y80/00 ; H01R12/59 ; B29C64/10 ; B33Y10/00 ; H05K3/00 ; B33Y30/00 ; H01B13/24 ; B29C64/106 ; H01R13/52
Abstract:
A wiring harness assembly includes a plurality of separated conductors formed of an electrically conductive material, a substrate formed of a dielectric material encasing the plurality of separated conductors, a location feature integrally formed with the substrate and an opening defined in the substrate having a predetermined size and shape. A section of the plurality of separated conductors is exposed within the opening. The opening is precisely located relative to the location feature.
Public/Granted literature
- US20190172607A1 WIRING HARNESS ASSEMBLY HAVING MULTIPLE SEPARATED CONDUCTORS EMBEDDED WITHIN A SUBSTRATE Public/Granted day:2019-06-06
Information query
