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1.发明申请公开(公告)号：US20200381140A1
公开(公告)日：2020-12-03
申请号：US16998324
申请日：2020-08-20
发明人： Jared Bilas , David R. Peterson , Kurt P. Seifert , Christopher G. Reider , Doyeon Y. Sohn , Gerald A. Rhinehart , Therese G. Stevens , George A. Drew , John T. Kightlinger
IPC分类号： H01B7/00 , H01B7/02 , H01B13/00 , H01B13/012 , H01B13/24 , H01B7/36 , H01B7/40 , H01R27/02 , H01R13/502 , H01R12/67 , B60R16/02 , B33Y80/00 , H01R12/59 , B29C64/10 , B29C64/106 , B33Y10/00 , H05K3/00 , B33Y30/00
摘要： A wiring harness assembly includes a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, a location feature integrally formed with the substrate, and an opening defined in the substrate located within a predetermined tolerance relative to the location feature. A section of the plurality of electrically conductive wires is exposed within the opening.
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2.发明申请公开(公告)号：US20190172607A1
公开(公告)日：2019-06-06
申请号：US16203691
申请日：2018-11-29
发明人： Jared Bilas , David R. Peterson , Kurt P. Seifert , Christopher G. Reider , Doyeon Y. Sohn , Gerald A. Rhinehart, JR. , Therese G. Stevens , George A. Drew , John T. Kightlinger
IPC分类号： H01B7/00 , H01B7/02 , H01B13/00 , H01B13/012 , H01B13/24 , H01B7/36 , H01B7/40 , H01R27/02 , H01R13/502 , H01R12/67 , B60R16/02
摘要： A wiring harness assembly includes a plurality of separated conductors formed of an electrically conductive material, a substrate formed of a dielectric material encasing the plurality of separated conductors, a location feature integrally formed with the substrate and an opening defined in the substrate having a predetermined size and shape. A section of the plurality of separated conductors is exposed within the opening. The opening is precisely located relative to the location feature.
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公开(公告)号：US10777334B2
公开(公告)日：2020-09-15
申请号：US16203691
申请日：2018-11-29
发明人： Jared Bilas , David R. Peterson , Kurt P. Seifert , Christopher G. Reider , Doyeon Y. Sohn , Gerald A. Rhinehart, Jr. , Therese G. Stevens , George A. Drew , John T. Kightlinger
IPC分类号： H01B7/00 , H01B7/02 , H01B13/00 , H01B13/012 , H01B7/36 , H01B7/40 , H01R27/02 , H01R13/502 , H01R12/67 , B60R16/02 , B33Y80/00 , H01R12/59 , B29C64/10 , B33Y10/00 , H05K3/00 , B33Y30/00 , H01B13/24 , B29C64/106 , H01R13/52
摘要： A wiring harness assembly includes a plurality of separated conductors formed of an electrically conductive material, a substrate formed of a dielectric material encasing the plurality of separated conductors, a location feature integrally formed with the substrate and an opening defined in the substrate having a predetermined size and shape. A section of the plurality of separated conductors is exposed within the opening. The opening is precisely located relative to the location feature.
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公开(公告)号：US11670434B2
公开(公告)日：2023-06-06
申请号：US17688252
申请日：2022-03-07
发明人： Jared Bilas , David R. Peterson , Kurt P. Seifert , Christopher G. Reider , Doyeon Y. Sohn , Gerald A. Rhinehart, Jr. , Therese G. Stevens , George A. Drew , John T. Kightlinger
IPC分类号： H01B7/00 , H01B7/02 , H01B13/00 , H01B13/012 , H01B13/24 , H01B7/36 , H01B7/40 , H01R27/02 , H01R13/502 , H01R12/67 , B60R16/02 , B33Y80/00 , H01R12/59 , B29C64/10 , B29C64/106 , B33Y10/00 , H05K3/00 , B33Y30/00 , H01R13/52
CPC分类号： H01B7/0045 , B29C64/10 , B29C64/106 , B33Y10/00 , B33Y30/00 , B33Y80/00 , B60R16/0207 , H01B7/009 , H01B7/0275 , H01B7/363 , H01B7/40 , H01B13/0013 , H01B13/01209 , H01B13/01236 , H01B13/01263 , H01B13/24 , H01R12/592 , H01R12/675 , H01R13/502 , H01R27/02 , H05K3/00 , H01B13/01254 , H01R13/5202 , H01R13/5205 , H01R2201/26
摘要： A method of manufacturing a wiring harness assembly includes the steps of forming a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, forming an opening in the substrate located and sized such that a section of the plurality of electrically conductive wires is exposed within the opening, disposing a support segment within the opening, securing a connector segment including a plurality of terminals to the support segment, and placing the plurality of terminals in mechanical and electrical contact with the plurality of electrically conductive wires.
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公开(公告)号：US20220189656A1
公开(公告)日：2022-06-16
申请号：US17688252
申请日：2022-03-07
发明人： Jared Bilas , David R. Peterson , Kurt P. Seifert , Christopher G. Reider , Doyeon Y. Sohn , Gerald A. Rhinehart , Therese G. Stevens , George A. Drew , John T. Kightlinger
IPC分类号： H01B7/00 , H01B7/02 , H01B13/00 , H01B13/012 , H01B13/24 , H01B7/36 , H01B7/40 , H01R27/02 , H01R13/502 , H01R12/67 , B60R16/02 , B33Y80/00 , H01R12/59 , B29C64/10 , B29C64/106 , B33Y10/00 , H05K3/00 , B33Y30/00
摘要： A method of manufacturing a wiring harness assembly includes the steps of forming a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, forming an opening in the substrate located and sized such that a section of the plurality of electrically conductive wires is exposed within the opening, disposing a support segment within the opening, securing a connector segment including a plurality of terminals to the support segment, and placing the plurality of terminals in mechanical and electrical contact with the plurality of electrically conductive wires.
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公开(公告)号：US11302460B2
公开(公告)日：2022-04-12
申请号：US16998324
申请日：2020-08-20
发明人： Jared Bilas , David R. Peterson , Kurt P. Seifert , Christopher G. Reider , Doyeon Y. Sohn , Gerald A. Rhinehart, Jr. , Therese G. Stevens , George A. Drew , John T. Kightlinger
IPC分类号： H01B7/00 , H01B7/02 , H01B13/00 , H01B13/012 , H01B13/24 , H01B7/36 , H01B7/40 , H01R27/02 , H01R13/502 , H01R12/67 , B60R16/02 , B33Y80/00 , H01R12/59 , B29C64/10 , B29C64/106 , B33Y10/00 , H05K3/00 , B33Y30/00 , H01R13/52
摘要： A wiring harness assembly includes a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, a location feature integrally formed with the substrate, and an opening defined in the substrate located within a predetermined tolerance relative to the location feature. A section of the plurality of electrically conductive wires is exposed within the opening.
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