- 专利标题： Solder ball, solder joint, and joining method
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申请号： US16419294申请日： 2019-05-22
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公开(公告)号： US10780530B2公开(公告)日： 2020-09-22
- 发明人: Hiroki Oshima , Takeo Saitoh , Takahiro Nishizaki , Tomohisa Kawanago , Masato Shiratori , Kaichi Tsuruta
- 申请人： Senju Metal Industry Co., Ltd.
- 申请人地址： JP Tokyo
- 专利权人： Senju Metal Industry Co., Ltd.
- 当前专利权人： Senju Metal Industry Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： The Webb Law Firm
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2cf874f4
- 主分类号： B23K35/00
- IPC分类号： B23K35/00 ; B23K35/26 ; B23K35/30 ; H05K3/34 ; B23K101/42
摘要：
A solder ball according to the present invention contains 0.2 to 2.2% by mass of Zn, and a balance of Sn, and has a spherical diameter of 0.1 to 120 μm and a yellowness (b*) in an L*a*b* color system of 2.70 or more and 9.52 or less. An oxide film is formed by performing aging treatment. By producing a solder ball having a yellowness of 2.70 or more and 9.52 or less, it is possible to suppress the growth of a Cu3Sn layer and/or a Cu—Zn(—Sn) layer during joining.
公开/授权文献
- US20190358752A1 Solder Ball, Solder Joint, and Joining Method 公开/授权日：2019-11-28
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