Invention Grant
- Patent Title: Integrated circuit device
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Application No.: US16181510Application Date: 2018-11-06
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Publication No.: US10784266B2Publication Date: 2020-09-22
- Inventor: Dong-oh Kim , Ki-seok Lee , Chan-sic Yoon , Je-min Park , Woo-song Ahn
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@d202d7f
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L23/538 ; H01L29/49 ; H01L21/265 ; H01L21/28 ; H01L21/285 ; H01L21/308 ; H01L29/66

Abstract:
An integrated circuit device includes: a substrate having a cell array area, which includes a first active region, and a peripheral circuit area, which includes a second active region; a direct contact connected to the first active region in the cell array area; a bit line structure connected to the direct contact in the cell array area; and a peripheral circuit gate structure on the second active region in the peripheral circuit area, wherein the peripheral circuit gate structure includes two doped semiconductor layers each being doped with a charge carrier impurity having different doping concentrations from each other.
Public/Granted literature
- US20190355728A1 INTEGRATED CIRCUIT DEVICE Public/Granted day:2019-11-21
Information query
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