Invention Grant
- Patent Title: Bonding apparatus and bonding method thereof
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Application No.: US15831191Application Date: 2017-12-04
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Publication No.: US10792754B2Publication Date: 2020-10-06
- Inventor: Kyung Hwan Jung , Ju Hwan Kim , Sang Kyo Shin , Gye Hwan Lim , Mun Sik Choi
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3f1c45c3
- Main IPC: B23K13/02
- IPC: B23K13/02 ; G02F1/1345 ; H05B6/44 ; G02F1/13 ; H05B6/14 ; B23K13/01 ; G02F1/1333 ; H05K3/36 ; G02F1/1368 ; H05K1/14 ; B23K101/36
Abstract:
A bonding apparatus includes a support member configured to support a first substrate of a display panel and a connecting member, a bonding unit located above the support member and configured to compress the first substrate and the connecting member against each other using a bonding head to which a heating member is attached, and a magnetic-field generating part configured to generate a magnetic field to heat the heating member in an electromagnetic induction method.
Public/Granted literature
- US20180154477A1 BONDING APPARATUS AND BONDING METHOD THEREOF Public/Granted day:2018-06-07
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