公开(公告)号：US10792754B2

公开(公告)日：2020-10-06

申请号：US15831191

申请日：2017-12-04

Applicant: Samsung Display Co., Ltd.

Inventor： Kyung Hwan Jung ,  Ju Hwan Kim ,  Sang Kyo Shin ,  Gye Hwan Lim ,  Mun Sik Choi

IPC: B23K13/02 ,  G02F1/1345 ,  H05B6/44 ,  G02F1/13 ,  H05B6/14 ,  B23K13/01 ,  G02F1/1333 ,  H05K3/36 ,  G02F1/1368 ,  H05K1/14 ,  B23K101/36

Abstract: A bonding apparatus includes a support member configured to support a first substrate of a display panel and a connecting member, a bonding unit located above the support member and configured to compress the first substrate and the connecting member against each other using a bonding head to which a heating member is attached, and a magnetic-field generating part configured to generate a magnetic field to heat the heating member in an electromagnetic induction method.