Invention Grant
- Patent Title: Wafer level packaging of light emitting diodes (LEDs)
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Application No.: US15499520Application Date: 2017-04-27
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Publication No.: US10854584B2Publication Date: 2020-12-01
- Inventor: Michael John Bergmann , David Todd Emerson , Joseph G. Clark , Christopher P. Hussell
- Applicant: Cree, Inc.
- Applicant Address: US NC Durham
- Assignee: CREE, INC.
- Current Assignee: CREE, INC.
- Current Assignee Address: US NC Durham
- Agency: Withrow & Terranova, P.L.L.C.
- Agent Vincent K. Gustafson
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/00 ; H01L33/38 ; H01L33/48 ; H01L33/50 ; H01L33/22 ; H01L25/075 ; H01L23/00
Abstract:
An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.
Public/Granted literature
- US20170229431A1 WAFER LEVEL PACKAGING OF LIGHT EMITTING DIODES (LEDS) Public/Granted day:2017-08-10
Information query
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