- 专利标题: Transmission line design with routing-over-void compensation
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申请号: US16021618申请日: 2018-06-28
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公开(公告)号: US10856407B2公开(公告)日: 2020-12-01
- 发明人: Khang Choong Yong , Bok Eng Cheah , Jackson Chung Peng Kong , Stephen Harvey Hall , Yun Rou Lim
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwegman Lundberg & Woessner, P.A.
- 优先权: MY2017702418 20170630
- 主分类号: H01P3/08
- IPC分类号: H01P3/08 ; H05K1/02 ; H01L23/64 ; H01L23/498 ; H01P3/10 ; H01P9/00 ; H03H7/38 ; H01L23/66
摘要:
Apparatus and methods are provided for ameliorating distortion issues associated with a conductor that passes over a void in a reference plane. In an example, the conductor can include a first part routed over a major surface of a first side of the reference plane structure and that approaches a first edge of the reference plane structure with a first trajectory, a second part routed over the major surface of a second side of the reference plane structure and that approaches a second edge of the reference plane structure with a second trajectory in-line with the first trajectory, and a third portion connecting the first portion with the second portion and having a third trajectory departing from the first trajectory and the second trajectory, the third portion configured to span the void.
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