- Patent Title: Integrated passive component and method for manufacturing the same
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Application No.: US15691014Application Date: 2017-08-30
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Publication No.: US10861840B2Publication Date: 2020-12-08
- Inventor: Yung-Shun Chang , Teck-Chong Lee , Chien-Hua Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L27/01
- IPC: H01L27/01 ; H01L49/02 ; H01L21/683

Abstract:
An integrated passive component comprises a capacitor, a first passivation layer, an inductor, an insulation layer and an external contact. The first passivation layer surrounds the capacitor. The inductor is on the first passivation layer and electrically connected to the capacitor. The inductor comprises a plurality of conductive pillars. The insulation layer is on the first passivation layer and surrounds each of the conductive pillars. The insulation layer comprises a first surface adjacent to the first passivation layer, a second surface opposite to the first surface, and a side surface extending between the first surface and the second surface. A ratio of a width of each of the conductive pillars to a height of each of the conductive pillars is about 1:7. The external contact is electrically connected to the inductor and contacts the second surface of the insulation layer and the side surface of the insulation layer.
Public/Granted literature
- US20190067261A1 INTEGRATED PASSIVE COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-02-28
Information query
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