Invention Grant
- Patent Title: Polishing compositions for reduced defectivity and methods of using the same
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Application No.: US16503198Application Date: 2019-07-03
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Publication No.: US10907074B2Publication Date: 2021-02-02
- Inventor: James McDonough , Saul Alvarado
- Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
- Applicant Address: US RI North Kingstown
- Assignee: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
- Current Assignee: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
- Current Assignee Address: US RI North Kingstown
- Agency: Ohlandt, Greeley, Ruggiero and Perle, LLP
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/306 ; H01L21/321 ; C09G1/04
Abstract:
Chemical mechanical polishing compositions include an abrasive, a first removal rate enhancer; and water; wherein the polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 μm bin size.
Public/Granted literature
- US20210002511A1 POLISHING COMPOSITIONS FOR REDUCED DEFECTIVITY AND METHODS OF USING THE SAME Public/Granted day:2021-01-07
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