公开(公告)号：US20230136601A1

公开(公告)日：2023-05-04

申请号：US17970668

申请日：2022-10-21

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Eric Turner ,  Bin Hu ,  Yannan Liang ,  James Johnston ,  James McDonough

IPC: C09G1/02 ,  H01L21/306 ,  H01L21/321

Abstract: A polishing composition includes an anionic abrasive; a pH adjuster; a transition metal catalyst; and an amino acid. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises tungsten or molybdenum; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.

公开(公告)号：US20230135325A1

公开(公告)日：2023-05-04

申请号：US17970667

申请日：2022-10-21

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Yannan Liang ,  Bin Hu ,  Abhudaya Mishra ,  Ting-Kai Huang ,  Yibin Zhang ,  James Johnston ,  James McDonough

IPC: C09G1/02 ,  H01L21/306

Abstract: A polishing composition includes an anionic abrasive, a pH adjuster a low-k removal rate inhibitor, a ruthenium removal rate enhancer, and water. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises ruthenium or a hard mask material; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.

公开(公告)号：US20230060999A1

公开(公告)日：2023-03-02

申请号：US17896259

申请日：2022-08-26

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： James McDonough ,  Bin Hu ,  Qingmin Cheng

IPC: C09G1/02 ,  H01L21/321

Abstract: The present disclosure provides a polishing composition that includes at least one first amine, at least one second amine, and other components such as azoles. The first amine has a low molecular weight, for example 120 g/mol or less. The second amine has a high molecular weight, for example 125 g/mol or higher. The compositions can polish substrates that include copper and molybdenum, or alloys of each, at a high selectivity of copper to molybdenum.

公开(公告)号：US10907074B2

公开(公告)日：2021-02-02

申请号：US16503198

申请日：2019-07-03

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： James McDonough ,  Saul Alvarado

IPC: C09G1/02 ,  H01L21/306 ,  H01L21/321 ,  C09G1/04

Abstract: Chemical mechanical polishing compositions include an abrasive, a first removal rate enhancer; and water; wherein the polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 μm bin size.

公开(公告)号：US20210301177A1

公开(公告)日：2021-09-30

申请号：US17214987

申请日：2021-03-29

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： James McDonough ,  Ting-Kai Huang ,  Yannan Liang ,  Shu-Wei Chang ,  Sung Tsai Lin ,  Liqing Wen

IPC: C09G1/02 ,  H01L21/321

Abstract: This disclosure features a polishing composition that includes at least one abrasive; at least one first corrosion inhibitor that includes a phosphate or a phosphonate group; at least one complexing agent; at least one second corrosion inhibitor that is at least one azole compound; and optionally a pH adjuster.

公开(公告)号：US20210002511A1

公开(公告)日：2021-01-07

申请号：US16503198

申请日：2019-07-03

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： James McDonough ,  Saul Alvarado

IPC: C09G1/02 ,  H01L21/306

Abstract: Chemical mechanical polishing compositions include an abrasive, a first removal rate enhancer; and water; wherein the polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 μm bin size.