公开(公告)号：US10907074B2

公开(公告)日：2021-02-02

申请号：US16503198

申请日：2019-07-03

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： James McDonough ,  Saul Alvarado

IPC: C09G1/02 ,  H01L21/306 ,  H01L21/321 ,  C09G1/04

Abstract: Chemical mechanical polishing compositions include an abrasive, a first removal rate enhancer; and water; wherein the polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 μm bin size.

公开(公告)号：US20210002511A1

公开(公告)日：2021-01-07

申请号：US16503198

申请日：2019-07-03

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： James McDonough ,  Saul Alvarado

IPC: C09G1/02 ,  H01L21/306

Abstract: Chemical mechanical polishing compositions include an abrasive, a first removal rate enhancer; and water; wherein the polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 μm bin size.