Invention Grant
- Patent Title: Electro-optical package and method of fabrication
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Application No.: US16382076Application Date: 2019-04-11
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Publication No.: US10921538B2Publication Date: 2021-02-16
- Inventor: Vivek Raghunathan , Vivek Raghuraman , Karlheinz Muth , David Arlo Nelson , Chia-Te Chou , Brett Sawyer , SeungJae Lee
- Applicant: ROCKLEY PHOTONICS LIMITED
- Applicant Address: GB London
- Assignee: ROCKLEY PHOTONICS LIMITED
- Current Assignee: ROCKLEY PHOTONICS LIMITED
- Current Assignee Address: GB London
- Agency: Lewis Roca Rothgerber Christie LLP
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/43 ; G02B6/42 ; H01L25/16 ; H05K1/02 ; H05K3/30
Abstract:
An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.
Public/Granted literature
- US11054597B2 Electro-optical package and method of fabrication Public/Granted day:2021-07-06
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