公开(公告)号：US10962728B2

公开(公告)日：2021-03-30

申请号：US16824609

申请日：2020-03-19

申请人： ROCKLEY PHOTONICS LIMITED

发明人： David Arlo Nelson ,  Seungjae Lee ,  Brett Sawyer

IPC分类号： G02B6/42 ,  H01L23/498 ,  H01L23/00 ,  H01L25/18 ,  H01L25/00 ,  H01L31/02

摘要： An assembly. In some embodiments, the assembly includes: a photonic integrated circuit; and an electronic integrated circuit. A front surface of the photonic integrated circuit abuts, in an area of overlap, against a front surface of the electronic integrated circuit. A first portion of the photonic integrated circuit overhangs a first edge of the electronic integrated circuit, and a first portion of the electronic integrated circuit overhangs a first edge of the photonic integrated circuit. A conductor on the front surface of the electronic integrated circuit is connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit.

公开(公告)号：US11054597B2

公开(公告)日：2021-07-06

申请号：US16382076

申请日：2019-04-11

申请人： ROCKLEY PHOTONICS LIMITED

发明人： Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson ,  Chia-Te Chou ,  Brett Sawyer ,  SeungJae Lee

IPC分类号： G02B6/12 ,  G02B6/43 ,  G02B6/42 ,  H01L25/16 ,  H05K1/02 ,  H05K3/30

摘要： An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

公开(公告)号：US10921538B2

公开(公告)日：2021-02-16

申请号：US16382076

申请日：2019-04-11

申请人： ROCKLEY PHOTONICS LIMITED

发明人： Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson ,  Chia-Te Chou ,  Brett Sawyer ,  SeungJae Lee

IPC分类号： G02B6/12 ,  G02B6/43 ,  G02B6/42 ,  H01L25/16 ,  H05K1/02 ,  H05K3/30

摘要： An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

公开(公告)号：US11342270B2

公开(公告)日：2022-05-24

申请号：US16690054

申请日：2019-11-20

申请人： ROCKLEY PHOTONICS LIMITED

发明人： Seungjae Lee ,  Brett Sawyer ,  Chia-Te Chou

IPC分类号： H01L23/538 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

摘要： A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.

公开(公告)号：US20200219865A1

公开(公告)日：2020-07-09

申请号：US16824609

申请日：2020-03-19

申请人： ROCKLEY PHOTONICS LIMITED

发明人： David Arlo Nelson ,  SEUNGJAE LEE ,  Brett Sawyer

IPC分类号： H01L25/18 ,  H01L31/02 ,  H01L25/00 ,  H01L23/00 ,  H01L23/498

摘要： An assembly. In some embodiments, the assembly includes: a photonic integrated circuit; and an electronic integrated circuit. A front surface of the photonic integrated circuit abuts, in an area of overlap, against a front surface of the electronic integrated circuit. A first portion of the photonic integrated circuit overhangs a first edge of the electronic integrated circuit, and a first portion of the electronic integrated circuit overhangs a first edge of the photonic integrated circuit. A conductor on the front surface of the electronic integrated circuit is connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit.

公开(公告)号：US11923327B2

公开(公告)日：2024-03-05

申请号：US17596252

申请日：2020-06-05

申请人： ROCKLEY PHOTONICS LIMITED

发明人： Michael Lee ,  John Paul Drake ,  Ying Luo ,  Vivek Raghunathan ,  Brett Sawyer

IPC分类号： H01L23/00 ,  H01L25/16

CPC分类号： H01L24/06 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L25/167 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/03462 ,  H01L2224/03614 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05015 ,  H01L2224/05018 ,  H01L2224/05024 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05172 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05555 ,  H01L2224/05558 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/06051 ,  H01L2224/061 ,  H01L2224/06102 ,  H01L2224/06505 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

摘要： A silicon integrated circuit. In some embodiments, the silicon integrated circuit includes a first conductive trace, on a top surface of the silicon integrated circuit, a dielectric layer, on the first conductive trace, and a second conductive trace, on the dielectric layer, connected to the first conductive trace through a first via.

公开(公告)号：US11387186B2

公开(公告)日：2022-07-12

申请号：US16690054

申请日：2019-11-20

申请人： ROCKLEY PHOTONICS LIMITED

发明人： Seungjae Lee ,  Brett Sawyer ,  Chia-Te Chou

IPC分类号： H01L23/538 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

摘要： A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.

公开(公告)号：US20200161243A1

公开(公告)日：2020-05-21

申请号：US16690054

申请日：2019-11-20

申请人： ROCKLEY PHOTONICS LIMITED

发明人： SEUNGJAE LEE ,  Brett Sawyer ,  Chia-Te Chou

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78

摘要： A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.

公开(公告)号：US12119307B2

公开(公告)日：2024-10-15

申请号：US17504125

申请日：2021-10-18

申请人： ROCKLEY PHOTONICS LIMITED

发明人： Chia-Te Chou ,  Brett Sawyer ,  David McCann

IPC分类号： H01L23/544 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0655 ,  H01L2223/54426 ,  H01L2224/1301 ,  H01L2224/16167 ,  H01L2224/17517 ,  H01L2924/146 ,  H01L2924/15323

摘要： An assembly. In some embodiments, the assembly includes a first semiconductor chip, a substrate, and a first alignment element. The alignment of the first semiconductor chip and the substrate may be determined at least in part by engagement of the first alignment element with a first recessed alignment feature, in a surface of the first semiconductor chip.

公开(公告)号：US11573387B2

公开(公告)日：2023-02-07

申请号：US16836815

申请日：2020-03-31

申请人： ROCKLEY PHOTONICS LIMITED

发明人： Brett Sawyer ,  Seungjae Lee ,  Chia-Te Chou ,  Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson

IPC分类号： G02B6/12 ,  G02B6/43 ,  G02B6/42

摘要： An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.