公开(公告)号：US11262498B2

公开(公告)日：2022-03-01

申请号：US16945569

申请日：2020-07-31

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Gerald Cois Byrd ,  Chia-Te Chou ,  Karlheinz Muth

IPC: G02B6/12 ,  G02B6/42 ,  H01L25/16 ,  H04B10/25 ,  H04B10/40

Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

公开(公告)号：US11054597B2

公开(公告)日：2021-07-06

申请号：US16382076

申请日：2019-04-11

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson ,  Chia-Te Chou ,  Brett Sawyer ,  SeungJae Lee

IPC: G02B6/12 ,  G02B6/43 ,  G02B6/42 ,  H01L25/16 ,  H05K1/02 ,  H05K3/30

Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

公开(公告)号：US10921538B2

公开(公告)日：2021-02-16

申请号：US16382076

申请日：2019-04-11

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson ,  Chia-Te Chou ,  Brett Sawyer ,  SeungJae Lee

IPC: G02B6/12 ,  G02B6/43 ,  G02B6/42 ,  H01L25/16 ,  H05K1/02 ,  H05K3/30

Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

公开(公告)号：US10761262B2

公开(公告)日：2020-09-01

申请号：US16051237

申请日：2018-07-31

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Gerald Cois Byrd ,  Chia-Te Chou ,  Karlheinz Muth

IPC: G02B6/12 ,  G02B6/42 ,  H01L25/16 ,  H04B10/25 ,  H04B10/40

Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

公开(公告)号：US11333907B2

公开(公告)日：2022-05-17

申请号：US16383309

申请日：2019-04-12

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： David Arlo Nelson ,  Vivek Raghuraman ,  David Erich Tetzlaff ,  Karlheinz Muth ,  Vivek Raghunathan

IPC: G02F1/01 ,  H03F1/32 ,  H04B10/50 ,  H04B10/588 ,  H03F3/217 ,  H03F3/24 ,  H03K17/687 ,  H03K19/20

Abstract: A system including an optical engine. In some embodiments, the system includes an integrated circuit in a first-level package, and the system includes the optical engine, in the first-level package, and the optical engine includes an electro-optical chip.

公开(公告)号：US11209678B2

公开(公告)日：2021-12-28

申请号：US16281035

申请日：2019-02-20

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Dong Yoon Oh ,  Hooman Abediasl ,  Gerald Cois Byrd ,  Karlheinz Muth ,  Yi Zhang ,  Aaron John Zilkie

IPC: G02F1/035 ,  G02F1/01 ,  G02F1/295 ,  G02B6/10 ,  G02F1/025 ,  G02F1/015

Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 μm away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.

公开(公告)号：US20200073050A1

公开(公告)日：2020-03-05

申请号：US16505674

申请日：2019-07-08

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Gerald Cois Byrd ,  David Arlo Nelson ,  Javid Messian ,  Thomas Pierre Schrans ,  Chia-Te Chou ,  Karlheinz Muth

IPC: G02B6/122 ,  H01L31/024 ,  H01L31/02 ,  H01L33/62 ,  H01L33/64

Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

公开(公告)号：US11815748B2

公开(公告)日：2023-11-14

申请号：US17540782

申请日：2021-12-02

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： James Dongyoon Oh ,  Hooman Abediasl ,  Gerald Cois Byrd ,  Karlheinz Muth ,  Yi Zhang ,  Aaron John Zilkie

IPC: G02F1/01 ,  G02F1/035 ,  G02F1/295 ,  G02B6/10 ,  G02F1/025 ,  G02F1/015

CPC classification number: G02F1/025 ,  G02F1/0157 ,  G02F2201/063 ,  G02F2203/21

Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 μm away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.

公开(公告)号：US20190333905A1

公开(公告)日：2019-10-31

申请号：US16393763

申请日：2019-04-24

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth

IPC: H01L25/18 ,  H01L31/02 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00

Abstract: An electro-optical package. In some embodiments, the package includes an electronic integrated circuit module, a first electro-optical component, and a photonic integrated circuit. The first electro-optical component may be in a top surface of the photonic integrated circuit. The electronic integrated circuit module may have a top surface facing toward and overlapping both a portion of the first electro-optical component, and a portion of the photonic integrated circuit.

公开(公告)号：US20190243164A1

公开(公告)日：2019-08-08

申请号：US16383309

申请日：2019-04-12

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： David Arlo Nelson ,  Vivek Raghuraman ,  David Erich Tetzlaff ,  Karlheinz Muth ,  Vivek Raghunathan

IPC: G02F1/01 ,  H03F3/24 ,  H03F1/32 ,  H03K17/687 ,  H03F3/217 ,  G02F1/17 ,  H04B10/588 ,  H04B10/50

CPC classification number: G02F1/0121 ,  G02F1/17 ,  H03F1/3241 ,  H03F3/217 ,  H03F3/245 ,  H03K17/687 ,  H03K19/20 ,  H04B10/505 ,  H04B10/588

Abstract: A system including an optical engine. In some embodiments, the system includes an integrated circuit in a first-level package, and the system includes the optical engine, in the first-level package, and the optical engine includes an electro-optical chip.