公开(公告)号：US11054597B2

公开(公告)日：2021-07-06

申请号：US16382076

申请日：2019-04-11

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson ,  Chia-Te Chou ,  Brett Sawyer ,  SeungJae Lee

IPC: G02B6/12 ,  G02B6/43 ,  G02B6/42 ,  H01L25/16 ,  H05K1/02 ,  H05K3/30

Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

公开(公告)号：US10921538B2

公开(公告)日：2021-02-16

申请号：US16382076

申请日：2019-04-11

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson ,  Chia-Te Chou ,  Brett Sawyer ,  SeungJae Lee

IPC: G02B6/12 ,  G02B6/43 ,  G02B6/42 ,  H01L25/16 ,  H05K1/02 ,  H05K3/30

Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

公开(公告)号：US20190333905A1

公开(公告)日：2019-10-31

申请号：US16393763

申请日：2019-04-24

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth

IPC: H01L25/18 ,  H01L31/02 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00

Abstract: An electro-optical package. In some embodiments, the package includes an electronic integrated circuit module, a first electro-optical component, and a photonic integrated circuit. The first electro-optical component may be in a top surface of the photonic integrated circuit. The electronic integrated circuit module may have a top surface facing toward and overlapping both a portion of the first electro-optical component, and a portion of the photonic integrated circuit.

公开(公告)号：US20190243164A1

公开(公告)日：2019-08-08

申请号：US16383309

申请日：2019-04-12

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： David Arlo Nelson ,  Vivek Raghuraman ,  David Erich Tetzlaff ,  Karlheinz Muth ,  Vivek Raghunathan

IPC: G02F1/01 ,  H03F3/24 ,  H03F1/32 ,  H03K17/687 ,  H03F3/217 ,  G02F1/17 ,  H04B10/588 ,  H04B10/50

CPC classification number: G02F1/0121 ,  G02F1/17 ,  H03F1/3241 ,  H03F3/217 ,  H03F3/245 ,  H03K17/687 ,  H03K19/20 ,  H04B10/505 ,  H04B10/588

Abstract: A system including an optical engine. In some embodiments, the system includes an integrated circuit in a first-level package, and the system includes the optical engine, in the first-level package, and the optical engine includes an electro-optical chip.

公开(公告)号：US11333907B2

公开(公告)日：2022-05-17

申请号：US16383309

申请日：2019-04-12

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： David Arlo Nelson ,  Vivek Raghuraman ,  David Erich Tetzlaff ,  Karlheinz Muth ,  Vivek Raghunathan

IPC: G02F1/01 ,  H03F1/32 ,  H04B10/50 ,  H04B10/588 ,  H03F3/217 ,  H03F3/24 ,  H03K17/687 ,  H03K19/20

Abstract: A system including an optical engine. In some embodiments, the system includes an integrated circuit in a first-level package, and the system includes the optical engine, in the first-level package, and the optical engine includes an electro-optical chip.

公开(公告)号：US11573387B2

公开(公告)日：2023-02-07

申请号：US16836815

申请日：2020-03-31

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Brett Sawyer ,  Seungjae Lee ,  Chia-Te Chou ,  Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson

IPC: G02B6/12 ,  G02B6/43 ,  G02B6/42

Abstract: An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.

公开(公告)号：US20200225430A1

公开(公告)日：2020-07-16

申请号：US16836815

申请日：2020-03-31

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Brett Sawyer ,  SEUNGJAE LEE ,  Chia-Te Chou ,  Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson

IPC: G02B6/43 ,  G02B6/42

Abstract: An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.

公开(公告)号：US20190317287A1

公开(公告)日：2019-10-17

申请号：US16382076

申请日：2019-04-11

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson ,  Chia-Te Chou ,  Brett Sawyer ,  SeungJae Lee

IPC: G02B6/43 ,  G02B6/42 ,  H01L25/16 ,  H05K3/30 ,  H05K1/02

Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

公开(公告)号：US12292605B2

公开(公告)日：2025-05-06

申请号：US17641418

申请日：2020-09-11

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Seungjae Lee ,  Chia-Te Chou ,  Vivek Raghunathan ,  Brett Sawyer

IPC: G02B6/42 ,  H01L23/00

Abstract: A siliconized heterogeneous optical engine. In some embodiments, the siliconized heterogeneous optical engine includes a photonic integrated circuit; an electro-optical chip, on a top surface of the photonic integrated circuit; an electronic integrated circuit, on the top surface of the photonic integrated circuit; an interposer, on the top surface of the photonic integrated circuit; a redistribution layer, on a top surface of the interposer, the redistribution layer including a plurality of conductive traces; and a plurality of protruding conductors, on the conductive traces of the redistribution layer. The electronic integrated circuit may be electrically connected to the electro-optical chip and to a conductive trace of the plurality of conductive traces of the redistribution layer.

公开(公告)号：US11923327B2

公开(公告)日：2024-03-05

申请号：US17596252

申请日：2020-06-05

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Michael Lee ,  John Paul Drake ,  Ying Luo ,  Vivek Raghunathan ,  Brett Sawyer

IPC: H01L23/00 ,  H01L25/16

CPC classification number: H01L24/06 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L25/167 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/03462 ,  H01L2224/03614 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05015 ,  H01L2224/05018 ,  H01L2224/05024 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05172 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05555 ,  H01L2224/05558 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/06051 ,  H01L2224/061 ,  H01L2224/06102 ,  H01L2224/06505 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A silicon integrated circuit. In some embodiments, the silicon integrated circuit includes a first conductive trace, on a top surface of the silicon integrated circuit, a dielectric layer, on the first conductive trace, and a second conductive trace, on the dielectric layer, connected to the first conductive trace through a first via.