Particular embodiments described herein provide for an electronic device that can be configured to include one or more heat sources, a heat pipe embedded in a chassis of the electronic device, where the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources, and a thermal cooling device, where the thermal cooling device is thermally coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis. In an example, the heat pipe is an oscillating heat pipe and has a thickness between about two (2) millimeters to about twelve (12) millimeters.