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1.发明申请SYSTEM AND METHOD FOR ADAPTIVE THERMAL AND PERFORMANCE MANAGEMENT IN ELECTRONIC DEVICES 有权电子设备自适应热和性能管理的系统和方法公开(公告)号：US20160091938A1
公开(公告)日：2016-03-31
申请号：US14669275
申请日：2015-03-26
Applicant: INTEL CORPORATION
Inventor： James W. Edwards , Meenakshi Gupta , Brian R. Peil , Nicholas R. Weber , Nicolas A. Kurczewski
CPC classification number: G06F1/206 , G06F1/1632 , G06F1/203 , G06F1/3215 , G06F1/3231 , G06F1/3262 , H01L2225/06589 , H01L2225/1094 , H05K7/20172 , H05K7/20209 , Y02D10/16 , Y02D10/173
Abstract: A system and method for adaptive thermal and performance management in electronic devices are disclosed. A particular embodiment includes: providing a processor with a plurality of selectable performance levels and a sensor in an electronic device; receiving sensor information from the sensor, the sensor information including information for determining if the electronic device is positioned proximately to an active airflow; determining a device context from the sensor information; and dynamically modifying the performance level of the processor by implementing one of a plurality of selectable performance levels of the processor based on the device context.
Abstract translation: 公开了一种用于电子设备中的自适应热和性能管理的系统和方法。 具体实施例包括：在电子设备中为处理器提供多个可选择的性能级别和传感器; 从所述传感器接收传感器信息，所述传感器信息包括用于确定所述电子设备是否位于活动气流附近的信息; 从传感器信息确定设备上下文; 以及基于所述设备上下文，通过实施所述处理器的多个可选性能级别中的一个来动态地修改所述处理器的性能级别。
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公开(公告)号：US10921869B2
公开(公告)日：2021-02-16
申请号：US16455323
申请日：2019-06-27
Applicant: Intel Corporation
Inventor： Mark Carbone , Juha Tapani Paavola , Nicholas R. Weber
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include one or more heat sources, a heat pipe embedded in a chassis of the electronic device, where the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources, and a thermal cooling device, where the thermal cooling device is thermally coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis. In an example, the heat pipe is an oscillating heat pipe and has a thickness between about two (2) millimeters to about twelve (12) millimeters.
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公开(公告)号：US20190324507A1
公开(公告)日：2019-10-24
申请号：US16455323
申请日：2019-06-27
Applicant: Intel Corporation
Inventor： Mark Carbone , Juha Tapani Paavola , Nicholas R. Weber
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include one or more heat sources, a heat pipe embedded in a chassis of the electronic device, where the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources, and a thermal cooling device, where the thermal cooling device is thermally coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis. In an example, the heat pipe is an oscillating heat pipe and has a thickness between about two (2) millimeters to about twelve (12) millimeters.
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公开(公告)号：US09690340B2
公开(公告)日：2017-06-27
申请号：US14669275
申请日：2015-03-26
Applicant: INTEL CORPORATION
Inventor： James W. Edwards , Meenakshi Gupta , Brian R. Peil , Nicholas R. Weber , Nicolas A. Kurczewski
CPC classification number: G06F1/206 , G06F1/1632 , G06F1/203 , G06F1/3215 , G06F1/3231 , G06F1/3262 , H01L2225/06589 , H01L2225/1094 , H05K7/20172 , H05K7/20209 , Y02D10/16 , Y02D10/173
Abstract: A system and method for adaptive thermal and performance management in electronic devices are disclosed. A particular embodiment includes: providing a processor with a plurality of selectable performance levels and a sensor in an electronic device; receiving sensor information from the sensor, the sensor information including information for determining if the electronic device is positioned proximately to an active airflow; determining a device context from the sensor information; and dynamically modifying the performance level of the processor by implementing one of a plurality of selectable performance levels of the processor based on the device context.
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