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    Device, system, and method to regulate temperature of a resonator structure
    1.
    发明授权
    Device, system, and method to regulate temperature of a resonator structure 有权

    公开(公告)号：US11611346B2

    公开(公告)日：2023-03-21

    申请号：US16449107

    申请日：2019-06-21

    Applicant: Intel Corporation

    Inventor： Catharina Biber ,  Jason Mix ,  Mark Carbone ,  Mohamed A. Abdelmoneum ,  Joshua Linden Levy ,  Timo Huusari ,  Sarah Shahraini

    IPC: H03L1/04 ,  H01L25/16 ,  H03B5/30

    Abstract: Techniques and mechanisms for regulating a temperature of a resonator structure. In an embodiment, a thermoelectric cooler (TEC) is thermally coupled to a resonator which is proximate thereto. The resonator supports operation with an oscillator circuit, wherein a resonance characteristic of the resonator contributes to oscillations of a master clock signal, or other oscillatory signal, which is provided with the oscillator circuit. The TEC provides Peltier functionality to selectively perform either one of heating or cooling the resonator. In another embodiment, the TEC is configured to conduct heat which is transferred via a path between the TEC and the resonator, wherein the path omits any circuitry which is to perform operations which are synchronized based on the oscillatory signal.

    TORSIONAL HEAT PIPE
    3.
    发明申请
    TORSIONAL HEAT PIPE 审中-公开

    公开(公告)号：US20190254194A1

    公开(公告)日：2019-08-15

    申请号：US16370918

    申请日：2019-03-30

    Applicant: Intel Corporation

    Inventor： Juha Tapani Paavola ,  Mikko Antero Makinen ,  Columbia Mishra ,  Mark Carbone

    IPC: H05K7/20 ,  F28D15/02

    CPC classification number: H05K7/20336 ,  F28D15/0208 ,  F28D2015/0216 ,  F28F2230/00

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a torsional heat pipe. The torsional heat pipe can include a first housing static portion located in a first housing of an electronic device, where the first housing static portion is coupled to a heat source, a second housing static portion located in a second housing of the electronic device, where the second housing static portion is coupled to a heat spreader, and a torsion portion located in a hinge of the electronic device, where the hinge rotatably couples the first housing to the second housing and the torsion portion rotates as the second housing rotates relative to the first housing and the torsion portion couples the first housing static portion to the second housing static portion.

    COORDINATING CONTROL LOOPS FOR TEMPERATURE CONTROL
    4.
    发明申请
    COORDINATING CONTROL LOOPS FOR TEMPERATURE CONTROL 有权
    协调控制温度控制

    公开(公告)号：US20150277454A1

    公开(公告)日：2015-10-01

    申请号：US14229336

    申请日：2014-03-28

    Applicant: Intel Corporation

    Inventor： Mark Carbone ,  Catharina R. Biber

    IPC: G05D23/19 ,  G05B15/02

    CPC classification number: G05B15/02 ,  G06F1/203 ,  G06F1/206 ,  G06F1/3234 ,  G06F1/3296 ,  Y02D10/16 ,  Y02D10/172

    Abstract: In one example a controller comprises logic, at least partially including hardware logic, configured to define a control relationship between a first control loop associated with a first heat source and a second control loop associated with a second heat source and enforce the control relationship during throttling operations of the first heat source and the second heat source. Other examples may be described.

    Abstract translation: 在一个示例中，控制器包括至少部分地包括硬件逻辑的逻辑，其被配置为定义与第一热源相关联的第一控制回路与与第二热源相关联的第二控制回路之间的控制关系，并且在调节期间执行控制关系 第一热源和第二热源的操作。 可以描述其他示例。

    Radiation shield around a component on a substrate
    6.
    发明授权
    Radiation shield around a component on a substrate 有权

    公开(公告)号：US11081450B2

    公开(公告)日：2021-08-03

    申请号：US16585052

    申请日：2019-09-27

    Applicant: Intel Corporation

    Inventor： Dong-Ho Han ,  Jaejin Lee ,  Je-Young Chang ,  Jerrod Peterson ,  Mark Carbone

    IPC: H01L23/552 ,  H01L21/48 ,  H01L23/367 ,  H01L23/498

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

    HEAT PIPE FOR IMPROVED THERMAL PERFORMANCE AT COLD PLATE INTERFACE
    7.
    发明申请
    HEAT PIPE FOR IMPROVED THERMAL PERFORMANCE AT COLD PLATE INTERFACE 有权

    公开(公告)号：US20210136956A1

    公开(公告)日：2021-05-06

    申请号：US17127355

    申请日：2020-12-18

    Applicant: Intel Corporation

    Inventor： Juha Paavola ,  Columbia Mishra ,  Justin Huttula ,  Mark Carbone

    IPC: H05K7/20 ,  B23P15/26 ,  G06F1/20

    Abstract: Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.

    RADIATION SHIELD AROUND A COMPONENT ON A SUBSTRATE
    8.
    发明申请
    RADIATION SHIELD AROUND A COMPONENT ON A SUBSTRATE 审中-公开

    公开(公告)号：US20200027844A1

    公开(公告)日：2020-01-23

    申请号：US16585052

    申请日：2019-09-27

    Applicant: Intel Corporation

    Inventor： Dong-Ho Han ,  Jaejin Lee ,  Je-Young Chang ,  Jerrod Peterson ,  Mark Carbone

    IPC: H01L23/552 ,  H01L23/498 ,  H01L23/367 ,  H01L21/48

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

    PER CHIPLET THERMAL CONTROL IN A DISAGGREGATED MULTI-CHIPLET SYSTEM
    10.
    发明申请
    PER CHIPLET THERMAL CONTROL IN A DISAGGREGATED MULTI-CHIPLET SYSTEM 审中-公开

    公开(公告)号：US20190384367A1

    公开(公告)日：2019-12-19

    申请号：US16551523

    申请日：2019-08-26

    Applicant: Intel Corporation

    Inventor： Amit Kumar Jain ,  Sameer Shekhar ,  Mark Carbone ,  Merwin M. Brown

    IPC: G06F1/20 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a plurality of chiplets, a plurality of resources, a system thermal engine, and at least one processor. The at least one processor is configured to cause the system thermal engine to monitor the plurality of chiplets, where the plurality of chiplets are part of a multi-chip module, determine that a first chiplet from the plurality of chiplets has reached a threshold temperature, and reduce power to the first chiplet without reducing power to the other chiplets in the plurality of chiplets.

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