Invention Grant
- Patent Title: RC-IGBT
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Application No.: US15998630Application Date: 2018-08-16
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Publication No.: US10930770B2Publication Date: 2021-02-23
- Inventor: Hans-Guenter Eckel , Quang Tien Tran
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102017118665.4 20170816
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/78 ; H01L29/861 ; H01L29/06 ; H01L29/10 ; H01L29/872 ; H01L29/08 ; H01L29/423

Abstract:
A power semiconductor device includes a semiconductor body, a first load terminal structure arranged at a front side of the semiconductor body, and a second load terminal structure arranged at a back side of the semiconductor body, and configured for controlling a load current between the load terminal structures by means of at least one transistor cell. The at least one transistor cell is at least partially included in the semiconductor body and electrically connected to the first load terminal structure on one side and to a drift region on the other side, the drift region being of a first conductivity type. The semiconductor body further includes: a transistor short region of the first conductivity type, wherein a transition between the transistor short region and the first load terminal structure forms a Schottky contact; and a separation region of a second conductivity type separating the transistor short and drift regions.
Public/Granted literature
- US20190058057A1 RC-IGBT Public/Granted day:2019-02-21
Information query
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