公开(公告)号：US10940958B2

公开(公告)日：2021-03-09

申请号：US15716700

申请日：2017-09-27

Applicant: The Boeing Company

Inventor： Daniel J Kovach ,  Gary E Georgeson ,  Robert J Miller ,  Jeffrey D Morgan ,  Diane Rawlings

IPC: B32B43/00 ,  B64D45/02 ,  H01B5/00 ,  B29C63/00 ,  C08K3/08 ,  B32B37/12 ,  B32B38/10 ,  H05B6/10 ,  H05B6/02 ,  C08L11/00

Abstract: Embodiments of the presently disclosed system include a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an “on-demand” de-bonding site for laminate deconstruction. For example, in some embodiments when the heating layer is inserted between a cured Carbon-Fiber Reinforced Plastic (CFRP) layer and a Polymeric/Metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally-applied time-varying magnetic field) to allow for ease of applique separation from the CFRP layer.

公开(公告)号：US20140363637A1

公开(公告)日：2014-12-11

申请号：US13911778

申请日：2013-06-06

Applicant: The Boeing Company

Inventor： Daniel J Kovach ,  Gary E Georgeson ,  Robert J Miller ,  Jeffrey D Morgan ,  Diane C Rawlings

IPC: B64D45/02 ,  H01B5/00 ,  B64C7/00 ,  C09J7/02

CPC classification number: B64D45/02 ,  B29C63/0013 ,  B32B37/12 ,  B32B43/006 ,  B32B2307/208 ,  B32B2405/00 ,  C08K3/08 ,  C08K2201/01 ,  C09J7/29 ,  H01B5/00 ,  Y10T156/10 ,  Y10T428/24843

Abstract: Embodiments of the presently disclosed system include a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an “on-demand” de-bonding site for laminate deconstruction. For example, in some embodiments when the heating layer is inserted between a cured Carbon-Fiber Reinforced Plastic (CFRP) layer and a Polymeric/Metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally-applied time-varying magnetic field) to allow for ease of applique separation from the CFRP layer.

Abstract translation: 本公开的系统的实施例包括装载有在时变磁场下加热的非聚合物夹杂物的薄的热塑性或热固性聚合物膜。 将这种附加加热层插入到结构或半结构的异质层压板中提供了用于层压解构的“按需”去粘合位点。 例如，在一些实施例中，当加热层插入固化的碳纤维增强塑料（CFRP）层和聚合/金属膜叠层之间时，加热层可以选择性地加热到高于其软化点（例如，通过使用能量 从局部施加的时变磁场吸收），以便容易地从CFRP层分离。