Provided is a composition comprising: (A) a silicone polymer of the Formula (I): M1aM2bM3cD1dD2eD3fT1gT2hT3iQj. wherein: M1=R1R2R3SiO1/2 M2=R4R5R6SiO1/2 M3=R7R8R9SiO1/2 D1=R10R11SiO2/2 D2=R12R13SiO2/2 D3=R14R15SiO2/2 T1=R16SiO3/2 T2=R17SiO3/2 T3=R18SiO3/2 Q=SiO4/2 where R1, R2, R3, R5, R6, R8, R9, R10, R11, R13, R15, R16 are independently chosen from a hydrogen, a C1-C60 aliphatic or aromatic group or C1-C60 alkoxy group; R4, R12, R17 are independently chosen from a C1-C10 alkyl, a C1-C10 alkoxy, or R19-A-R20— where A is chosen from a group comprising an unsaturated cyclic moiety chosen from an aromatic group, a fused aromatic group, an unsaturated alicyclic group, an unsaturated heterocyclic group, or a combination of two or more thereof; R19 is chosen from a —H, a C1-C10 alkyl, allyl, vinyl, alkoxy, allyloxy, vinyloxy, acrylate, or methacrylate; and R20 is chosen from a divalent organic group; R7, R14, R18 are independently selected from hydrogen or OR22 or unsaturated monovalent radicals or radicals containing heteroatom such as oxygen, nitrogen, sulfur or radicals containing organosilane groups; and the subscripts a, b, c, d, e, f, g, h, i, j are zero or positive subject to the following limitations: 2≤a+b+c+d+e+f+g+h+i+j≤1000, b+e+h>0 and c+f+i≥0 and B) a thermally conductive filler.