Invention Grant
- Patent Title: Power feed member and substrate processing apparatus
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Application No.: US16016990Application Date: 2018-06-25
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Publication No.: US10943766B2Publication Date: 2021-03-09
- Inventor: Shunichi Ito , Shinji Himori , Etsuji Ito , Naokazu Furuya , Gen Tamamushi
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2017-124344 20170626
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683 ; H01L21/67 ; H01L21/687
Abstract:
A power feed member having high heat insulation and capable of transmitting a power at a low loss is provided. The power feed member configured to supply a power includes a first conductive member; a second conductive member; and a connecting member configured to electrically connect the first conductive member and the second conductive member. At least a part of the connecting member is formed of a porous metal or multiple bulk metals.
Public/Granted literature
- US20180374679A1 POWER FEED MEMBER AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2018-12-27
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