PLASMA SPRAYING APPARATUS AND SPRAYING CONTROL METHOD

    公开(公告)号:US20190256962A1

    公开(公告)日:2019-08-22

    申请号:US16348577

    申请日:2017-10-27

    Abstract: A plasma spraying apparatus includes a supplier configured to carry powder of a spray material by a plasma generation gas and jet the powder of the spray material and the plasma generation gas from an opening at a leading end thereof; a plasma generator configured to form, by using the jetted plasma generation gas, a plasma having an axis center shared by the supplier; a magnetic field generator configured to generate a magnetic field in a space where the plasma is formed; and a controller configured to control the magnetic field generator to control a deflection of the plasma.

    Plasma processing apparatus
    4.
    发明授权

    公开(公告)号:US11756769B2

    公开(公告)日:2023-09-12

    申请号:US17220982

    申请日:2021-04-02

    Abstract: A plasma processing apparatus includes: a chamber accommodating a plurality of substrates; a plurality of substrate supports provided inside the chamber and configured to support a substrate; a plurality of radio-frequency power sources provided corresponding to the plurality of substrate supports, and configured to supply radio-frequency power to the plurality of substrate supports, respectively; and a plurality of shields configured to compart the inside of the chamber and provided corresponding to the plurality of substrate supports to define a processing space where plasma is generated. A radio-frequency current path is formed between the plurality of shields so as not to interfere with one another.

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