Invention Grant
- Patent Title: Strap-cell architecture for embedded memory
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Application No.: US16364405Application Date: 2019-03-26
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Publication No.: US10943913B2Publication Date: 2021-03-09
- Inventor: Wen-Tuo Huang , Ping-Cheng Li , Hung-Ling Shih , Po-Wei Liu , Yu-Ling Hsu , Yong-Shiuan Tsair , Chia-Sheng Lin , Shih Kuang Yang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L27/11521
- IPC: H01L27/11521 ; H01L23/528 ; H01L23/532 ; H01L29/49 ; H01L29/423 ; H01L29/66 ; H01L29/40 ; H01L21/768 ; H01L23/522 ; H01L29/788 ; H01L21/28

Abstract:
Various embodiments of the present application are directed towards an integrated memory chip comprising a memory array with a strap-cell architecture that reduces the number of distinct strap-cell types and that reduces strap-line density. In some embodiments, the memory array is limited to three distinct types of strap cells: a source line/erase gate (SLEG) strap cell; a control gate/word line (CGWL) strap cell; and a word-line strap cell. The small number of distinct strap-cell types simplifies design of the memory array and further simplifies design of a corresponding interconnect structure. Further, in some embodiments, the three distinct strap-cell types electrically couple word lines, erase gates, and control gates to corresponding strap lines in different metallization layers of an interconnect structure. By spreading the strap lines amongst different metallization layers, strap-line density is reduced.
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