Invention Grant
- Patent Title: Multilevel semiconductor device and structure
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Application No.: US17027217Application Date: 2020-09-21
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Publication No.: US10943934B2Publication Date: 2021-03-09
- Inventor: Zvi Or-Bach , Deepak C. Sekar , Paul Lim
- Applicant: Monolithic 3D Inc.
- Applicant Address: US CA San Jose
- Assignee: Monolithic 3D Inc.
- Current Assignee: Monolithic 3D Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patent Law Office www.patent office: LC
- Agent Bao Tran
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/0232 ; H01L25/04 ; H01L31/0368 ; H01L31/102 ; H01L27/28 ; H01L27/12

Abstract:
A multi-level semiconductor device, the device including: a first level including integrated circuits; a second level including an optical waveguide, where the second level is disposed above the first level, where the first level includes crystalline silicon; and an oxide layer disposed between the first level and the second level, where the second level is bonded to the oxide layer, and where the bonded includes oxide to oxide bonds.
Public/Granted literature
- US20210005762A1 MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE Public/Granted day:2021-01-07
Information query
IPC分类: