Invention Grant
- Patent Title: Polishing agent, stock solution for polishing agent, and polishing method
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Application No.: US15556824Application Date: 2016-03-08
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Publication No.: US10946494B2Publication Date: 2021-03-16
- Inventor: Masayuki Hanano , Masaya Nishiyama , Yutaka Goh , Haruaki Sakurai , Tomohiro Iwano
- Applicant: Hitachi Chemical Company, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JPJP2015-046958 20150310
- International Application: PCT/JP2016/057222 WO 20160308
- International Announcement: WO2016/143797 WO 20160915
- Main IPC: B24B37/00
- IPC: B24B37/00 ; C09G1/02 ; B24B37/04 ; C09K3/14 ; H01L21/311 ; H01L21/3105 ; B24B37/005
Abstract:
A polishing agent for polishing a resin comprises abrasive grains, a water-soluble polymer having an ether bond, an organic solvent and water, wherein the abrasive grains have a positive charge in the polishing agent and an average particle diameter of the abrasive grains is larger than 20 nm.
Public/Granted literature
- US20180043497A1 Polishing Agent, Stock Solution for Polishing Agent, and Polishing Method Public/Granted day:2018-02-15
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