Invention Grant
- Patent Title: Adaptive multi-tier power distribution grids for integrated circuits
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Application No.: US16366918Application Date: 2019-03-27
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Publication No.: US10956645B2Publication Date: 2021-03-23
- Inventor: Joon Hyung Chung , Mikhail Popovich , Gudoor Reddy
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/52 ; H01L23/48 ; G06F30/394 ; G06F30/39 ; G06F30/327 ; G06F30/392 ; G06F30/398 ; H01L23/522 ; H01L23/528 ; G06F115/08 ; G06F119/06
Abstract:
The place and route stage for a hard macro is modified to assign a more robust power-grid tier to a critical path for a hard macro and to assign a less robust power-grid tier to a remainder of the hard macro.
Public/Granted literature
- US20190220571A1 ADAPTIVE MULTI-TIER POWER DISTRIBUTION GRIDS FOR INTEGRATED CIRCUITS Public/Granted day:2019-07-18
Information query
IPC分类:
