Invention Grant
- Patent Title: Integrating extra gate VFET with single gate VFET
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Application No.: US16182848Application Date: 2018-11-07
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Publication No.: US10957599B2Publication Date: 2021-03-23
- Inventor: Zhenxing Bi , Kangguo Cheng , Junli Wang , Peng Xu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Randall Bluestone
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L21/8234 ; H01L27/088

Abstract:
Embodiments of the present invention are directed to techniques for integrating an extra gate (EG) vertical field effect transistor (VFET) with a single gate (SG) VFET. In a non-limiting embodiment of the invention, a bottom source or drain (S/D) layer is formed over a substrate. A first semiconductor fin is formed over the bottom S/D layer in a first region of the substrate and a second semiconductor fin is formed over the bottom S/D layer in a second region of the substrate. A block mask is formed over the first semiconductor fin and the second semiconductor fin is recessed. The second semiconductor fin is exposed to an isotropic or anisotropic fin trim.
Information query
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