Invention Grant
- Patent Title: Method of manufacturing light emitting device
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Application No.: US16737904Application Date: 2020-01-09
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Publication No.: US10967588B2Publication Date: 2021-04-06
- Inventor: Motokazu Yamada , Masakazu Kotani , Tetsuji Seino , Shinsaku Ikuta
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Mori & Ward, LLP
- Priority: JP2015-050645 20150313
- Main IPC: B29D11/00
- IPC: B29D11/00 ; H01L33/54 ; H01L33/00 ; B29K83/00 ; B29K105/04 ; B29L31/34 ; H01L33/50
Abstract:
A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.
Public/Granted literature
- US20200147908A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2020-05-14
Information query
