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公开(公告)号:US10569487B2
公开(公告)日:2020-02-25
申请号:US16393926
申请日:2019-04-24
Applicant: NICHIA CORPORATION
Inventor: Motokazu Yamada , Masakazu Kotani , Tetsuji Seino , Shinsaku Ikuta
Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.
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公开(公告)号:US10967588B2
公开(公告)日:2021-04-06
申请号:US16737904
申请日:2020-01-09
Applicant: NICHIA CORPORATION
Inventor: Motokazu Yamada , Masakazu Kotani , Tetsuji Seino , Shinsaku Ikuta
Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.
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公开(公告)号:US10391727B2
公开(公告)日:2019-08-27
申请号:US15925848
申请日:2018-03-20
Applicant: NICHIA CORPORATION
Inventor: Motokazu Yamada , Masakazu Kotani , Tetsuji Seino , Shinsaku Ikuta
Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis.
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公开(公告)号:US09956731B2
公开(公告)日:2018-05-01
申请号:US15067239
申请日:2016-03-11
Applicant: NICHIA CORPORATION
Inventor: Motokazu Yamada , Masakazu Kotani , Tetsuji Seino , Shinsaku Ikuta
IPC: B29D11/00 , H01L33/00 , B29K83/00 , B29K105/04 , B29L31/34
CPC classification number: B29D11/00865 , B29D11/0074 , B29D11/00807 , B29K2083/00 , B29K2105/04 , B29K2995/0018 , B29L2031/3481 , H01L33/00 , H01L33/505 , H01L33/54 , H01L2933/005
Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis. The covering member tapers toward the bottom surface.
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