Invention Grant
- Patent Title: High frequency module and communication device
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Application No.: US16533982Application Date: 2019-08-07
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Publication No.: US10971466B2Publication Date: 2021-04-06
- Inventor: Katsunari Nakazawa , Takanori Uejima , Motoji Tsuda , Yuji Takematsu , Dai Nakagawa , Tetsuro Harada , Masahide Takebe , Naoya Matsumoto , Yoshiaki Sukemori , Mitsunori Samata , Yutaka Sasaki , Yuuki Fukuda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2018-150622 20180809
- Main IPC: H03F3/21
- IPC: H03F3/21 ; H03F1/30 ; H01L23/00 ; H01L25/16 ; H01L23/66 ; H01L23/367 ; H01L23/538 ; H04B1/40
Abstract:
A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.
Public/Granted literature
- US20200051943A1 HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2020-02-13
Information query
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