Invention Grant
- Patent Title: Semiconductor laser device, semiconductor laser module, and laser light source system for welding
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Application No.: US16234344Application Date: 2018-12-27
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Publication No.: US10971897B2Publication Date: 2021-04-06
- Inventor: Norio Ikedo , Tougo Nakatani , Takahiro Okaguchi , Takeshi Yokoyama , Tomohito Yabushita , Toru Takayama
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2016-130584 20160630
- Main IPC: H01S5/16
- IPC: H01S5/16 ; B23K26/21 ; B23K26/06 ; B23K37/00 ; H01S5/10 ; B23K26/70 ; H01S5/042 ; H01S5/343 ; H01S5/20

Abstract:
A semiconductor laser device includes: a first conductivity side semiconductor layer, an active layer; and a second conductivity side semiconductor layer. The second conductivity side semiconductor layer includes a first semiconductor layer and a second semiconductor layer, the first semiconductor layer being closer to the active layer than the second semiconductor layer is. The second semiconductor layer defines a width of a current injection region for injecting current into an optical waveguide. The current injection region includes a width varying region in which a width varies. S1>S2, where S1 denotes a width of the width varying region on a front end face side, and S2 denotes a width of the width varying region on a rear end face side.
Public/Granted literature
- US20190131770A1 SEMICONDUCTOR LASER DEVICE, SEMICONDUCTOR LASER MODULE, AND LASER LIGHT SOURCE SYSTEM FOR WELDING Public/Granted day:2019-05-02
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