Invention Grant
- Patent Title: SiC substrate, SiC epitaxial wafer, and method of manufacturing the same
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Application No.: US16599645Application Date: 2019-10-11
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Publication No.: US10985042B2Publication Date: 2021-04-20
- Inventor: Yoshitaka Nishihara , Koji Kamei
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2018-195266 20181016
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; C30B29/06 ; C30B29/36

Abstract:
A SiC substrate includes a first principal surface, a second principal surface disposed on a side opposite to the first principal surface, and an outer periphery connected to the first principal surface and the second principal surface, wherein a density of composite defects present at a peripheral edge portion of the SiC substrate, in which a hollow portion and a dislocation line extending from the hollow portion are connected to each other is equal to or greater than 0.01 pieces/cm2 and equal to or less than 10 pieces/cm2.
Information query
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