Invention Grant
- Patent Title: Semiconductor device with local connection
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Application No.: US16542595Application Date: 2019-08-16
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Publication No.: US10985063B2Publication Date: 2021-04-20
- Inventor: Kangguo Cheng , Lawrence A. Clevenger , Carl Radens , Junli Wang , John H. Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Joseph Petrokaitis
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L21/768 ; H01L27/092 ; H01L21/8238

Abstract:
A first TS is coupled to first S/D over first fin, second TS coupled to second S/D over first fin, third TS coupled to third S/D over second fin, fourth TS coupled to fourth S/D over second fin, gate metal over first and second fins, and gate cap over gate metal. First TS cap is on first TS, second TS cap on second TS, third TS cap on third TS, and fourth TS cap on fourth TS. ILD is formed on top of gate cap and first through fourth TS caps. First opening is through ILD and second TS cap such that part of gate metal is exposed, after removing part of gate cap. Second opening is through ILD to expose another part of gate metal. Combined gate metal contact and local metal connection is formed in first opening and individual gate metal contact is formed in second opening.
Public/Granted literature
- US20200027787A1 SEMICONDUCTOR DEVICE WITH LOCAL CONNECTION Public/Granted day:2020-01-23
Information query
IPC分类: