Invention Grant
- Patent Title: Semiconductor laser device, semiconductor laser module, and laser light source system for welding
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Application No.: US16228683Application Date: 2018-12-20
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Publication No.: US10985533B2Publication Date: 2021-04-20
- Inventor: Tougo Nakatani , Takahiro Okaguchi , Norio Ikedo , Takeshi Yokoyama , Tomohito Yabushita , Toru Takayama , Shoichi Takasuka
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2016-130546 20160630
- Main IPC: H01S5/34
- IPC: H01S5/34 ; H01S5/343 ; H01S5/223 ; H01S5/20 ; H01S5/00 ; H01S5/022 ; H01S5/40 ; H01S5/32

Abstract:
A semiconductor laser device includes: a first semiconductor layer on a first conductivity side; a second semiconductor layer on the first conductivity side; an active layer; a third semiconductor layer on a second conductivity side different from the first conductivity side; and a fourth semiconductor layer on the second conductivity side. Eg2 N3 is satisfied, where N2 denotes an impurity concentration of the second semiconductor layer, and N3 denotes an impurity concentration of the third semiconductor layer.
Public/Granted literature
- US20190148916A1 SEMICONDUCTOR LASER DEVICE, SEMICONDUCTOR LASER MODULE, AND LASER LIGHT SOURCE SYSTEM FOR WELDING Public/Granted day:2019-05-16
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