Invention Grant
- Patent Title: Method and apparatus for treating substrate
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Application No.: US15603188Application Date: 2017-05-23
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Publication No.: US11000879B2Publication Date: 2021-05-11
- Inventor: Byungsun Bang
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: KR10-2016-0065843 20160527
- Main IPC: B05D3/06
- IPC: B05D3/06 ; H01L21/67 ; H01L21/02 ; B05C9/14 ; B05C11/08 ; B05C11/10 ; B05C21/00 ; B05D3/02 ; B05D3/10 ; B05D5/08 ; B05D1/00

Abstract:
Provided is a method and apparatus for treating a substrate with a liquid. The substrate treating method comprises a pre-treating step for supplying the treatment liquid containing hydrogen fluoride (HF) to the substrate and treating the substrate before the surface modification step and a surface modification step for supplying an alkene-based chemical onto a substrate to change the surface of the substrate to a hydrophobic state. As a result, the surface of the substrate is uniform, and generation of particles can be reduced when the substrate is removed.
Public/Granted literature
- US20170341106A1 METHOD AND APPARATUS FOR TREATING SUBSTRATE Public/Granted day:2017-11-30
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