- 专利标题: Method for manufacturing light emitting device
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申请号: US16452602申请日: 2019-06-26
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公开(公告)号: US11005008B2公开(公告)日: 2021-05-11
- 发明人: Senpeng Huang , Zhen-duan Lin , Weng-Tack Wong , Junpeng Shi , Shunyi Chen , Chih-Wei Chao , Chen-ke Hsu
- 申请人: Xiamen San'An Optoelectronics Co., Ltd.
- 申请人地址: CN Fujian
- 专利权人: Xiamen San'An Optoelectronics Co., Ltd.
- 当前专利权人: Xiamen San'An Optoelectronics Co., Ltd.
- 当前专利权人地址: CN Fujian
- 代理机构: Thomas|Horstemeyer, LLP
- 优先权: CN201710685818.5 20170811
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; H01L33/22 ; H01L33/44 ; H01L33/50 ; H01L33/54 ; H01L33/60
摘要:
A light emitting device includes an LED chip, a light-transmissible member and a light-reflecting member. The LED chip has a plurality of interconnecting side surfaces having a roughened structure and a plurality of corners. The light-transmissible member covers the side surfaces and the corners and includes a light-transmissible material layer having a breadth value W(A) of a viscosity coefficient (A) range of the light-transmissible material, which satisfies a relation of W(A)∝B*D/C: where B represents a thickness of the light-transmissible material layer, represents a thickness of the LED chip measured from the first surface to the second surface, and D represents a roughness of the roughened structure. A method for manufacturing the light emitting device is also provided.
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