公开(公告)号：US11005008B2

公开(公告)日：2021-05-11

申请号：US16452602

申请日：2019-06-26

申请人： Xiamen San'An Optoelectronics Co., Ltd.

发明人： Senpeng Huang ,  Zhen-duan Lin ,  Weng-Tack Wong ,  Junpeng Shi ,  Shunyi Chen ,  Chih-Wei Chao ,  Chen-ke Hsu

IPC分类号： H01L33/00 ,  H01L33/22 ,  H01L33/44 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60

摘要： A light emitting device includes an LED chip, a light-transmissible member and a light-reflecting member. The LED chip has a plurality of interconnecting side surfaces having a roughened structure and a plurality of corners. The light-transmissible member covers the side surfaces and the corners and includes a light-transmissible material layer having a breadth value W(A) of a viscosity coefficient (A) range of the light-transmissible material, which satisfies a relation of W(A)∝B*D/C: where B represents a thickness of the light-transmissible material layer, represents a thickness of the LED chip measured from the first surface to the second surface, and D represents a roughness of the roughened structure. A method for manufacturing the light emitting device is also provided.