- Patent Title: Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive composition
-
Application No.: US16224812Application Date: 2018-12-19
-
Publication No.: US11016385B2Publication Date: 2021-05-25
- Inventor: Yi-Chi Yang , Shou-Yi Ho , Kuo-Chan Chiou
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW107129097 20180821
- Main IPC: G03F7/027
- IPC: G03F7/027 ; G03F7/033 ; G03F7/085 ; G03F7/004 ; C09J4/00 ; C09J165/04 ; G03F7/032 ; G03F7/021 ; C08K3/38 ; C08K3/28 ; C08F16/32 ; C08G61/04 ; C08K3/14 ; C08K3/22
Abstract:
The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition.
Public/Granted literature
Information query
IPC分类:
