Invention Grant
- Patent Title: Magnetic shielding of STT-MRAM in multichip packaging and method of manufacturing the same
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Application No.: US16432500Application Date: 2019-06-05
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Publication No.: US11018093B2Publication Date: 2021-05-25
- Inventor: Bharat Bhushan , Juan Boon Tan , Boo Yang Jung , Wanbing Yi , Danny Pak-Chum Shum
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ditthavong, Steiner & Mlotkowski
- Main IPC: H01L23/552
- IPC: H01L23/552 ; G11C11/16 ; H01L27/22 ; H01L25/16 ; H01L23/485 ; H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L21/78
Abstract:
Methodologies and an apparatus for enabling magnetic shielding of stand alone MRAM are provided. Embodiments include placing MRAM dies and logic dies on a first surface of a mold frame; forming a top magnetic shield over top and side surfaces of the MRAM dies; forming a mold cover over the MRAM dies, FinFET dies and mold frame; removing the mold frame to expose a bottom surface of the MRAM dies and FinFET dies; and forming a bottom magnetic shield over the bottom surface of the MRAM dies.
Public/Granted literature
- US20190287921A1 MAGNETIC SHIELDING OF STT-MRAM IN MULTICHIP PACKAGING AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-09-19
Information query
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